Yield optimization in advanced manufacturing rarely proceeds as a tidy pipeline; it arises from the gradual convergence of evidence across spatial wafer patterns, multivariate metrology, and asynchronous process and equipment events that interact in ways that are only partially observable. Prior studies often separate these modalities, assigning convolutional encoders to wafer maps, sequence models to metrology, and template based encoders to logs, an arrangement that can perform well locally yet struggles to sustain cross-modal alignment or to reason over the hierarchy that links defects to steps and equipment. Building on these observations, we introduce a manufacturing semantics oriented... More >