ICCK Transactions on Intelligent Cyber-Physical Systems | Volume 1, Issue 2: 83-85, 2026 | DOI: 10.62762/TICPS.2026.636441
Abstract
Digital twin (DT) technology has evolved beyond static physical mapping into a dynamic intelligence layer for smart manufacturing. We argue that three capabilities are now decisive for advancing DT production lines in complex industrial environments: data-driven quality correction through nonlinear feature learning, real-time edge vision for surface defect sensing, and deep time-series modeling for predictive maintenance. We further contend that the next inflection point lies not in individual algorithmic improvements, but in the cognitive integration of structured engineering knowledge-such as Manufacturer Knowledge Packages (MKP) and the Theory of Inventive Problem Solving (TRIZ)-with gene... More >